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This Master Class is a practical introduction to the changes necessary in design, component selection, assembly and soldering with lead-free alloys. It covers the practical experience gained during lead-free trails, process introduction and running hands on lead-free lines and training events for the past 5 years.

Lead-Free Inspection, Process Control and Defect Elimination

Lead-free assembly does have an impact on the design, manufacture and the potential reliability of printed board assemblies. Although the fundamental processes do not change, process parameters do change and there are process issues what are coming to light that do affect yields. This workshop will provide a practical insight into the inspection criteria, changes to process conditions and how to monitor the process to obtain the highest yields.

Reflow Soldering Lead-Free Alloys - Successfully

Reflow soldering with lead-free alloys is far less demanding to convert than wave. However there are new issues of material compatibility, higher temperatures, lead contamination and the benefits of using pin in hole/intrusive reflow to consider.

Lead-Free Joints Rework and Repair Hand Soldering and De-soldering

Rework and repair of lead-free solder joints requires higher process temperatures, this can impact on the printed circuit board and components used today. The rework fluxes used and the equipment also require consideration along with greater attention to profiling board assemblies for rework.

Lead-Free Wave Soldering Process Troubleshooting

Do we have all the answers to successful lead-free wave soldering? No, and to quote a well know soldering metallurgist, "We don’t even know all the questions". Lead-free is new to many and the wave soldering process is the most effected by the change of materials with cost increase in alloy, solder bath and copper erosion plus increased temperatures makes process change demanding.

Ball Grid Array Inspection Lead-Free Defect Guide

Area Array Technology is part of mainstream electronics but very little inspection criteria is available in the industry. The assembly process for BGAs is fairly well understood for tin/lead alloys but with the move to lead-free assembly there are critical issues to consider during inspection.

Lead-Free Design for Manufacture Assembly Workshop

This workshop is aimed at Design, Production and Quality Engineers. It will provide a better understanding of the effect lead-free will have on printed board design, specification and procurement. Component specification and testing requirements to meet WEEE and RoHS will be discussed along with the simple guidance on ranking circuit board solder finishes.