Selective Soldering

The A.C.E. Selective soldering systems have been developed to simplify the soldering process of attaching through hole electronic components onto printed circuit boards that also have surface mount components attached to the under side.
The compact solder pot has interchangeable drop in nozzles, is mounted on a precision X/Y axis control plus Z height movement with an over the top laser positioning system for easy alignment and pin point positioning of the solder joint. These compact systems can solder down to 1.5mm spacing between components. Available as table top, stand alone or inline. A.C.E Selective Soldering Systems ~ KISS (Keep It Simple Soldering).