Stencil apertures can be cleaned within the printer or off line on a bench using ultrasonic cleaning equipment. An absorbent pad dampened with cleaning fluid is placed within a tray under the stencil. Fluid is applied to the top surface prior to placing the Ultrasonic Head (US) in direct contact with the stencil. After just a few seconds all solder paste or adhesive residues trapped within the aperture walls will be released by the ultrasonic + solvent action.
Direct Ultrasonic "On Contact" cleaning is used within automatic stencil cleaning equipment. A wall of Ultrasonic transducers fills the complete stencil area whilst cleaning fluid is pumped between both sides of the stencil. Cleaning cycles are under 2 minutes.
Dirty test probes on In - Circuit test machine make contact with the printed circuit board difficult and gives inconsistent results. When cleaning pins with a brush damage can occur and the cleaning method is incomplete. An absorbent pad dampened with solvent positioned over the pins plus the action of a portable ultrasonic transducer will clean the pins perfectly in seconds without any risk of pin movement or damage.